"Semiconductor Packaging Expert" Dr. Lee Chunheung to Lead HPSP

HPSP Appoints Dr. Lee Chunheung as New CEO
Ideal Leader to Strengthen Competitiveness in HBM Packaging
Over 20 Years of Experience in Semiconductor Packaging
Served at Intel, Stats ChipPAC, and Lam Research

Dr. Lee Chunheung, recognized as one of the top experts in semiconductor packaging, has been appointed to lead the Korean semiconductor equipment company HPSP.

Lee Chunheung, the newly appointed CEO of HPSP. Provided by HPSP

On September 29, HPSP announced that Dr. Lee has been named as its new Chief Executive Officer (CEO).

HPSP explained that Dr. Lee was selected as the next CEO to strengthen the company’s competitiveness and global market dominance, especially as the importance of semiconductor packaging technology in high bandwidth memory (HBM) increases due to the rapid expansion of the generative artificial intelligence (AI) market. Dr. Lee is scheduled to be officially appointed as the new CEO at the shareholders’ meeting and board of directors meeting in November.

Dr. Lee stated, “As AI technology expands and global companies fiercely compete to secure leadership in semiconductors, I feel a great sense of responsibility and mission to lead HPSP, Korea’s leading semiconductor equipment company. Going forward, I will strive to further enhance HPSP’s unrivaled technological capabilities in the global market and ensure that we build strong expertise in the back-end process sector, which has become even more critical due to the surging demand for HBM.”

Dr. Lee began his career in packaging at Amkor Technology and, over the past 20 years, has developed core technologies and executed strategies in collaboration with leading global companies, earning significant trust within the industry. Most recently, he served as Senior Vice President at Intel, overseeing the Advanced Test Technology Development (ATTD) organization responsible for packaging test technology. He is credited with laying the foundation for Intel’s competitiveness in the foundry (semiconductor contract manufacturing) business.

In addition, Dr. Lee served as CEO and Chief Technology Officer (CTO) at Stats ChipPAC Group, one of the world’s top three outsourced semiconductor assembly and test (OSAT) companies. During his tenure, he turned around five consecutive years of losses to profitability within just one year, drawing significant attention from the industry. While working at Lam Research, a wafer manufacturing equipment and services company, he established advanced packaging strategies, achieved the number one market share in China, and played a major role in expanding the customer base to Korea and other global markets.

With Dr. Lee’s appointment as CEO, HPSP plans to expand its core business of high-pressure hydrogen annealing (HPA) in the front-end semiconductor process and invest more in research and development (R&D) to build competitive technologies in the back-end process sector as well. The company also announced its intention to actively target overseas markets, expand technological cooperation with global and domestic research institutions, and further elevate the status of “K-Semiconductors.”

HPSP was founded in 2017. The company manufactures HPA equipment essential for the semiconductor front-end process and supplies it to leading semiconductor manufacturers worldwide. HPSP was listed on KOSDAQ on July 15, 2022, and in the first half of this year, recorded sales of 88.2 billion won, operating profit of 47.3 billion won, and net profit of 35.9 billion won. Compared to the same period last year, these figures represent growth of 35.6%, 47.8%, and 0.4%, respectively, in the first half of this year.

This content was produced with the assistance of AI translation services.