Hanmi Semiconductor Unveils 2.5D Big Die TC and FC Bonders for the First Time at SEMICON Taiwan

Hanmi Semiconductor announced on September 10 that it will unveil two new pieces of equipment for AI semiconductors-the "2.5D Big Die TC Bonder" and the "Big Die FC Bonder"-for the first time at the "2025 SEMICON Taiwan" exhibition, which runs through September 12 in Taipei, Taiwan.

The new equipment marks Hanmi Semiconductor's official entry into the rapidly growing 2.5D packaging market for AI semiconductors.

2.5D packaging is an advanced technology that integrates multiple chips-such as GPU, CPU, and HBM-into a single package on a silicon interposer. This technology expands bandwidth between chips, improves data transfer speeds, and enhances power efficiency, leading global AI semiconductor companies like Nvidia and AMD to actively adopt it.

TSMC's CoWoS (Chip on Wafer on Substrate) is a representative 2.5D packaging technology and has become a core technology in the fields of AI semiconductors and high-performance computing.

Unlike conventional general-purpose semiconductors, which are typically 20mm x 20mm, Hanmi Semiconductor's "2.5D Big Die TC Bonder" and "Big Die FC Bonder" support large interposer packaging of up to 120mm x 120mm. Customers can choose between the TC Bonder and the FC Bonder depending on the characteristics of their semiconductors.

Hanmi Semiconductor is also introducing its new "TC Bonder 4" for HBM4 production at the exhibition for the first time. As major global memory companies plan to begin mass production of HBM4 early next year, demand for the "TC Bonder 4" is expected to increase. The company will also promote various flagship devices, such as the "7th Generation Micro Saw Vision Placement (MSVP) 6.0 Griffin." MSVP is an essential piece of semiconductor manufacturing equipment that performs cutting, cleaning, drying, inspection, sorting, and stacking of semiconductor packages.

Hanmi Semiconductor leads the global market for TC Bonders for HBM and has maintained the number one position worldwide in the MSVP market for 21 consecutive years since 2004.

Since 2015, Hanmi Semiconductor has participated in SEMICON Taiwan as an official sponsor. At this year's exhibition, the company will also unveil collaborative artwork with pop artist Philip Colbert, launching new marketing initiatives.

A Hanmi Semiconductor representative stated, "SEMICON Taiwan is a global event where advanced semiconductor packaging and AI semiconductor technologies converge. We will showcase our 2.5D packaging bonder equipment at the exhibition and continue to strengthen our competitiveness in system semiconductors."

Celebrating its 30th anniversary this year, SEMICON Taiwan is the most influential semiconductor industry exhibition in Taiwan, organized by the international Semiconductor Equipment and Materials International (SEMI). This year’s event is the largest ever, featuring 1,200 semiconductor technology companies from around the world-including Applied Materials, Lam Research, and Tokyo Electron-operating 4,100 booths. More than 100,000 industry experts are expected to attend.

This content was produced with the assistance of AI translation services.