On the 24th, SK Hynix stated during the Q3 earnings conference call that "the shipment volume of the 5th generation high-bandwidth memory (HBM), HBM3E, in the third quarter surpassed that of the 4th generation HBM3," and added, "In the fourth quarter, shipments of the 12-layer HBM3E product will begin as scheduled." They further mentioned, "In the first half of next year, the proportion of 12-layer HBM3E products is expected to increase to more than half of the total HBM3E shipments."




[Concall] SK Hynix "12-Stack Product Shipment in First Half of Next Year, Over Half of Total HBM3E" View original image


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