Jestem Completes 'Semiconductor Equipment Evaluation' at Micron Boise Plant in the US

Boyish Production Line Scheduled to Operate Next Year

Semiconductor equipment company Jeostem announced on the 8th that it successfully completed the evaluation of the 'N2 LPM (Lord Port Module)' equipment at Micron's Technology Innovation Center (R&D Fab) in Boise, Idaho, USA, at the end of last month.

Lim Young-jin, CEO of Jeostem / Photo by Jeostem

The N2 LPM is equipment that controls the internal humidity of FOUPs (Front Opening Unified Pods), which store and transport wafers during semiconductor processing, and removes impurities to improve yield (the ratio of good products among finished products). Jeostem holds over 80% market share in related equipment.

Jeostem stated, "The evaluation was conducted as a final review to apply the equipment to the new production line to be established in Boise," and added that the possibility of receiving orders has increased. They also said, "In the fiercely competitive environment of high-bandwidth memory (HBM) manufacturing, the role of N2 LPM as essential equipment for yield improvement is growing."

Micron has technology innovation centers in Boise and its headquarters in the United States and is constructing a production line equivalent to the size of 10 soccer fields, aiming to start factory operations next year. After completion, advanced DRAM and HBM will be produced on this line.

Since 2019, Jeostem has been supplying N2 LPM to Micron's global production lines in Japan, Taiwan, and Singapore. Currently, this equipment has also been introduced to high-bandwidth memory (HBM) production lines in Japan and Taiwan.

Jeostem's Chief Technology Officer (CTO), Yongjin Kim, said, "After next year, the Boise factory will become a major production line," and added, "Since the equipment testing was successfully completed locally, we will be able to continuously supply quantities in the future."

This content was produced with the assistance of AI translation services.