Son Ho-young, SK Hynix Vice President, "Will Become a 'Customer-Customized' Comprehensive AI Memory Supplier"

Interview with Our Newsroom on the 27th
Developing Chips to Handle Various AI
"Will Meet Any Customer Demand"

Son Ho-young, Vice President of Advanced Package Development at SK Hynix, stated on the 27th, "SK Hynix will establish itself as a comprehensive artificial intelligence (AI) memory semiconductor supplier."

Vice President Son made this remark during an interview with the company's newsroom. As AI technology is being utilized in various fields, the hardware to implement it is also diversifying. Last year, during the development process of SK Hynix's advanced package technology, one team handled the integration work. This was suitable for reducing trial and error in the early stages of development. As the technology became more advanced and diverse, the situation changed to one where customized AI memory semiconductors for customers had to be created. Flexibility and scalability of technology became important.

Vice President Son said, "We plan to subdivide the existing organization and enhance the expertise of each team," adding, "Since memory characteristics must become more diverse to implement various AI, we plan to possess the necessary advanced package technology and provide solutions that meet any customer needs."

Son Ho-young, Vice President of Advanced PKG Development at SK Hynix. [Photo by SK Hynix]

Vice President Son was promoted to an executive this year. Last year, he developed advanced package technology, one of the core elements of HBM (High Bandwidth Memory) semiconductors. This technology is a semiconductor package solution that can secure high performance while overcoming the wafer integration technology limits for securing high capacity. Recognized for his contributions to technology development, he received the 'Haedong Young Engineer Award' as a team leader, an award usually given to executives.

Additionally, he led the development from the early stages of TSV (Through Silicon Via), known as a core technology of HBM, and SK Hynix's proprietary technology MR-MUF. Simply put, he is credited with contributing to SK Hynix emerging as a leading company in HBM semiconductors.

Vice President Son and other SK Hynix executives interpret the development of HBM as a "case of creating something from nothing." They have developed the cutting-edge 5th generation HBM3E product and advanced package technology. They are also striving not to lose leadership in next-generation AI memory technology.

Vice President Son emphasized the importance of securing technological capabilities from a long-term perspective. He mentioned that when developing TSV technology and HBM initially, actively interacting with academia and external parties in a free environment was helpful.

He said, "I want to help our members become global number one engineers through exchanges with external parties," adding, "Creating an environment and culture where members can freely pursue what they want and grow together is the most important goal."

This content was produced with the assistance of AI translation services.