"Overseas and Technology Cooperation" Support for Advanced Semiconductor Packaging Development
A project to support domestic semiconductor materials, components, equipment, and post-processing companies, academia, and research institutes in promoting technological cooperation with leading overseas research institutions and companies for the development of advanced semiconductor packaging super-gap technologies will be launched this year.
The Ministry of Trade, Industry and Energy announced on the 14th the 'Electronic Components Industry Technology Development (Advanced Strategic Industry Super-Gap Technology Development Semiconductor)' project to secure technological competitiveness related to advanced semiconductor packaging in Korea.
Advanced packaging has emerged as a core technology due to the increasing demand for high-performance and multifunctional semiconductors driven by digital transformation, overcoming the technical limits of fine processes, and the growing need for single packaging of individual devices.
In particular, the development of new materials for heterogeneous bonding and multi-layer stacking, as well as advanced process development for implementing advanced packaging technologies such as chiplets and 3D, has become a key topic in securing semiconductor super-gap technologies.
This project has a total budget of 39.4 billion KRW (19.8 billion KRW in 2024) and will be supported through a matching fund system between government funds and private contributions. The support areas include processes and equipment, analysis and inspection, and materials for advanced packaging, targeting domestic semiconductor-related academia, research institutes, and companies.
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Selected institutions can receive government grants of up to 5.55 billion KRW over 33 months. Applications will be accepted from the 14th until March 14th, and detailed information about the project announcement can be found on the Pan-Ministry Integrated Research Support System.
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