Minister Lee Jong-ho: "Semiconductor Advanced Packaging is a Core Technology"... 100 Billion Won Invested Over 5 Years

The Ministry of Science and ICT announced on the 30th that it visited LG Innotek to observe research sites related to substrates for advanced semiconductor packaging and held a roundtable meeting.

Presided over by Minister Jong-ho Lee, this roundtable was held to gather on-site opinions as the government plans to promote research and development (R&D) projects related to advanced semiconductor packaging next year. Industry, academia, and research experts participated, including Moon Hyuk-soo, CEO of LG Innotek; Kim Hyung-jun, Head of the Next-Generation Intelligent Semiconductor Business Group; Kang Sung-won, Vice President of the Electronics and Telecommunications Research Institute (ETRI); and Lee Ki-hyung, Vice President of Industry-Academic Cooperation at Hanyang University. During the meeting, they shared trends and the importance of advanced semiconductor packaging and discussed effective government R&D support policies and development plans. LG Innotek also presented the current status and plans for semiconductor substrate R&D, emphasizing the importance of securing core technologies.

Hwang Pan-sik, Director of Basic and Fundamental Research Policy at the Ministry of Science and ICT, stated, "Starting next year, we plan to promote R&D, workforce training, and international cooperation projects to secure core technologies related to advanced packaging," adding that more than 100 billion KRW will be invested over the next five years.

The new advanced packaging projects primarily aim to secure core technologies related to 3D stacking, high-efficiency and fine-pitch packaging, high-heat dissipation packaging structures, next-generation interposers, ultra-fine substrates, and substrate processes. A separate talent development project will also be promoted to train master's and doctoral-level specialists specialized in the advanced packaging field. This initiative is based on the 'Semiconductor Future Technology Roadmap' prepared jointly with related ministries in May of this year by the Ministry of Science and ICT.

Minister Jong-ho Lee said, "Advanced packaging is a core technology that addresses the limits of semiconductor miniaturization, and competing countries have already recognized its importance and are actively investing at the national level," adding, "The Ministry of Science and ICT will strive to enhance semiconductor technological competitiveness through active investment in next-generation promising technologies."

This content was produced with the assistance of AI translation services.