Hanmi Semiconductor Ships Hyper Model for HBM

Semiconductor equipment company Hanmi Semiconductor has shipped the 3rd generation model of high bandwidth memory (HBM) process equipment. Following the delivery of the 2nd generation model in August, the company released the 3rd generation hyper model just three months later.

Hanmi Semiconductor announced on the 28th that it has shipped the 3rd generation model of essential HBM process equipment, the ‘Dual TC Bonder Griffin,’ for the first time.

The company is leading the market by supplying HBM equipment to global semiconductor firms. Dongshin Kwak, Vice Chairman of Hanmi Semiconductor, explained, "The Dual TC Bonder Griffin is the latest 3rd generation hyper model equipped with cutting-edge technology," and added, "It is bonding equipment that stacks semiconductor chips made using the Through-Silicon Via (TSV) process onto wafers."

The Dual TC Bonder Griffin is characterized by significantly improved productivity and precision in semiconductor chip stacking compared to previous products. Hanmi Semiconductor offers both Griffin (hyper model) and Dragon (premium model) options for the Dual TC Bonder according to customer demand.

Vice Chairman Kwak stated, "We expect this to be a key piece of equipment that will greatly contribute to next year’s sales."

Recently, Hanmi Semiconductor has significantly increased its sales and profitability as the artificial intelligence (AI) semiconductor market rapidly grows. The company has also set a goal to achieve sales of 650 billion KRW by 2025. On the 13th, it announced a dividend plan of 40.7 billion KRW, the largest since its founding.

A Hanmi Semiconductor representative explained, "As AI semiconductor demand increases, semiconductor manufacturers are accelerating their investments in HBM expansion."

This content was produced with the assistance of AI translation services.