Hanmi Semiconductor Announces Largest Dividend Since Establishment

Kwak Dong-shin, Vice Chairman and CEO of Hanmi Semiconductor, announced on the 13th that a cash dividend of 420 KRW per share, totaling 40.7 billion KRW, will be paid for the '2023 fiscal year.'

This is the largest dividend in the company's history, surpassing the total dividend of 29.7 billion KRW in 2021. Hanmi Semiconductor revised its articles of incorporation in March this year, setting the dividend record date as March 7 every year. Shareholders who wish to receive the dividend must hold Hanmi Semiconductor shares as of March 7 next year.

Kwak Dong-shin, Vice Chairman of Hanmi Semiconductor, said, "Starting with the announcement of the largest dividend in the company's history, we will continue to expand the dividend payout ratio."

In September this year, Hanmi Semiconductor received orders worth approximately 101.2 billion KRW from SK Hynix. It succeeded in securing orders for the 3rd generation hyper model ‘Dual TC Bonder Griffin,’ an essential production equipment for AI memory semiconductors and HBM, and sales are expected to increase. Major fabless companies such as Nvidia and AMD, key players in the HBM market, are also increasing their HBM orders. According to industry sources, SK Hynix is reportedly planning large-scale investments to expand HBM capacity. Samsung Electronics is also accelerating investments to expand its packaging line in preparation for the surge in HBM demand and plans to increase production by more than 2.5 times. US-based Micron plans to complete preparations for mass production of HBM3E by the first quarter of next year.

Hanmi Semiconductor expects HBM demand to surge due to the expansion of AI and data centers, thereby increasing the possibility of supplying equipment to global HBM manufacturers including SK Hynix.

Last month, Vice Chairman Kwak granted employees company shares worth 30 billion KRW. At that time, he said, "Next year will be the busiest year since the company's founding," and decided to grant company shares to motivate and encourage employees. The exercise of rights for these company shares will be possible starting in 2026.

Vice Chairman Kwak said, "In August, we established the Bonder Factory among five factories covering 20,000 pyeong at the Incheon headquarters," adding, "Hanmi Semiconductor’s processing factory holds over 200 large CNC machine tools, improving processing capabilities to prepare for additional demand from HBM customers." He further stated, "We have completed preparations to mass-produce TC Bonders."

Hanmi Semiconductor has filed 106 patents (including pending applications) for TC bonding equipment to date. Based on this, it is expected to secure a competitive edge with outstanding technology and durability, further enhancing the competitiveness of its equipment.

According to a report released by global investment bank Morgan Stanley in September, the global HBM market size is expected to grow from approximately 4 billion USD (about 5.2 trillion KRW) in 2023 to about 33 billion USD (about 43 trillion KRW) by 2027, with an annual growth rate of approximately 52.5%.

This content was produced with the assistance of AI translation services.