[Concall] Samsung Electronics "Focusing on HBM and 2.5D Packaging to Expand Foundry"
On the 31st, Samsung Electronics announced its foundry expansion strategy in response to the increasing demand for generative AI during its Q3 earnings conference call. The company stated, "Due to the rapid surge in generative AI demand, there continues to be a shortage of AI accelerator modules within data centers," adding, "Among the components of AI accelerator modules, HBM memory and 2.5D packaging have been identified as bottlenecks, so we plan to quickly expand supply capacity focusing on these areas and monitor additional supply and demand situations while proceeding with the expansion."
Hot Picks Today
"You Might Regret Not Buying Now"... Overseas Retail Investors Stirred by News of Record-Breaking Monster Stocks' IPOs
- "Not Jealous of Winning the Lottery"... Entire Village Stunned as 200 Million Won Jackpot of Wild Ginseng Cluster Discovered at Jirisan
- Mistaken for the Flu, Left Untreated... Death Toll Surges as WHO Declares Emergency (Comprehensive)
- "Concerns Over Expanded Travel Rule"... FIU Holds Closed Meeting with Virtual Asset Industry on Enforcement Decree of the Act on Specified Financial Transaction Information
- "How Did an Employee Who Loved Samsung End Up Like This?"... Past Video of Samsung Electronics Union Chairman Resurfaces
Samsung Electronics announced preliminary consolidated results for the third quarter with sales of 67 trillion KRW and an operating profit of 2.4 trillion KRW, exceeding expectations by more than 2 trillion KRW. The photo was taken on the 11th at Samsung Electronics Seocho Building in Seoul. Photo by Jinhyung Kang aymsdream@
View original image© The Asia Business Daily(www.asiae.co.kr). All rights reserved.
