Yesty Secures Core Equipment Order for Global Companies' HBM

Yesty, a semiconductor specialist company, announced on the 5th through a public disclosure that it has secured an order worth 7.5 billion KRW for core equipment used in the production of high-bandwidth memory (HBM) from a global semiconductor company. Following this order, additional orders for HBM equipment are expected by the first half of next year, with the supply scale anticipated to be substantial. The ordering customer plans to make large-scale investments next year to expand HBM production capacity, making it highly likely that orders will continue into the second half of next year.

The wafer pressing equipment supplied by Yesty is applied in the ‘underfill’ stage, one of the key processes of HBM. Underfill is a process that uniformly cures insulating material to prevent warpage of the HBM. Since HBM is made by stacking multiple DRAM chips, maintaining balance between chips and removing impurities are critical.

Since 2011, Yesty has accumulated technical know-how on various pressing equipment through independent research and development and national projects. In 2014, it developed the first square chamber pressing equipment in Korea and has been supplying it to global semiconductor companies. Because Yesty supplied wafer pressing equipment for HBM from the early stages of domestic semiconductor companies’ HBM development, it has well-established related references.

A Yesty official stated, “Based on high-temperature and high-pressure control technology, we have secured several patents in the pressing equipment field, establishing entry barriers,” and added, “The wafer pressing equipment ordered this time is an additional supply of previously delivered HBM equipment, so the testing procedures are omitted and delivery will be made immediately for mass production.”

He continued, “With the spread of AI services, not only will demand for HBM increase, but the development of next-generation high-performance HBM will also accelerate,” emphasizing, “Yesty plans to expand its product lineup from wafer pressing equipment for HBM to ‘package pressing equipment’ and ‘HBM chillers,’ while also focusing on developing equipment for next-generation high-performance HBM, expecting to benefit from the expansion of the HBM market.”

This content was produced with the assistance of AI translation services.