Hanmi Semiconductor Secures Order for Next-Generation HBM TC Bonder... Achieves 100 Billion KRW in One Month

Hanmi Semiconductor announced on the 4th that it has received an order worth approximately 60 billion KRW from SK Hynix for the 3rd generation hyper model ‘Dual TC Bonder Griffin (DUAL TC BONDER GRIFFIN).’ It is one of the essential process equipment for next-generation HBM (High Bandwidth Memory) used in artificial intelligence (AI) semiconductors.

Following the 41.6 billion KRW order for HBM TC Bonder received from SK Hynix on the 1st of last month, Hanmi Semiconductor recorded orders exceeding 100 billion KRW within a month.

Hanmi Semiconductor Vice Chairman Kwak Dong-shin introduced, "The Dual TC Bonder Griffin is a 3rd generation hyper bonding equipment with significantly improved productivity and precision for semiconductor chip stacking, designed for next-generation HBM production."

The Dual TC Bonder is sold in two models: the hyper model Griffin and the premium model Dragon, tailored to meet customer needs and specifications. If additional overseas customer orders are added, sales are expected to increase next year. Recently, Kwak Dong-shin, the largest shareholder of Hanmi Semiconductor, has increased his stake to 35.78% by investing a total of 14.8 billion KRW and purchasing 282,300 treasury shares since July.

Hanmi Semiconductor showed confidence in its future due to the growth of the AI market and the launch of new equipment for HBM. Established in 1980, Hanmi Semiconductor participated as an official sponsor in ‘SEMICON Taiwan’ held last month in Taipei, Taiwan. They showcased the 'TC Bonder CW,' a 2.5D package type applicable to TSMC’s ‘CoWoS (Chip on Wafer on Substrate) package.’

This content was produced with the assistance of AI translation services.