LG·Samsung, 'FC-BGA' Battle... Jeolcheol Dong Jeong "50 Years of Know-How Revealed"

Participation in Korea's Largest Substrate Exhibition KPCA Show 2023
Jung Cheol-dong, LG Innotek President, "Continuous New Product Launches"
Samsung is the Only Domestic Mass Producer of Server FC-BGA

Samsung Electro-Mechanics and LG Innotek announced on the 5th that they will participate in Korea's largest substrate exhibition, 'KPCA Show 2023 (International PCB and Semiconductor Packaging Industry Exhibition),' held from the 6th to the 9th at Songdo Convensia in Yeonsu-gu, Incheon. They will showcase a large number of new advanced semiconductor substrates, FC-BGA (Flip Chip-Ball Grid Array). FC-BGA is a high-density circuit substrate that connects non-memory semiconductor chips to the main substrate, and both companies have identified it as a new growth engine business area. It is an essential component in high value-added semiconductor products such as PC and server central processing units (CPU), graphics processing units (GPU), and communication chipsets.

This year marks the 20th edition of the event. Chung Cheol-dong, President of LG Innotek and Chairman of the KPCA Association, is scheduled to attend the opening ceremony on the first day and deliver the opening address. President Chung said, "As the importance of substrates for semiconductors continues to grow, LG Innotek plans to showcase its unparalleled technology accumulated over more than 50 years to domestic and international customers at the event," adding, "We will continue to launch new high value-added substrate materials that provide differentiated customer experiences."

Jung Cheol-dong, President and CEO of LG Innotek and Chairman of KPCA (Korea PCB & Packaging Industry Association). [Photo by LG Innotek]

LG Innotek emphasized the FC-BGA substrate zone as the "highlight of this exhibition booth" by placing it as the first viewing order. LG Innotek is increasing circuit integration density through proprietary technologies such as fine patterning and ultra-small via (circuit connection hole) processing technology for FC-BGA.

Samsung Electro-Mechanics is the only company in Korea mass-producing server-grade FC-BGA. At this exhibition, it plans to focus on displaying high-end (high-quality) FC-BGA substrates for servers. The server-grade FC-BGA introduced by Samsung Electro-Mechanics is a top-tier product with a size four times larger than general FC-BGA substrates and an internal layer count twice as many (over 20 layers).

Kim Eung-su, Vice President and Head of the Package Solution Division at Samsung Electro-Mechanics, said, "As demand for high-spec and high-performance semiconductors increases, substrates have emerged as a key factor differentiating semiconductor performance," adding, "Samsung Electro-Mechanics will continue to discover core manufacturing technologies based on FC-BGA technology and expand its global market share."

Kim Eung-su, Vice President and Head of Package Solution Division at Samsung Electro-Mechanics.
[Photo by Asia Economy DB]

Both companies plan to showcase advanced substrates beyond FC-BGA at the exhibition. LG Innotek will exhibit innovative substrate products such as 'Package Substrate' and 'Tape Substrate.' In the package substrate exhibition area, FC-BGA and RF-SiP (Radio Frequency System in Package) 3D models will be displayed alongside actual products. LG Innotek is the world’s number one company in RF-SiP. In the tape substrate zone, the world’s number one COF (Chip On Film) product and a 2-metal COF 3D model will be exhibited.

Samsung Electro-Mechanics will also unveil substrates for mobile IT. They will introduce FCCSP (Flip Chip Chip Scale Package), which applies a coreless process that removes the core (internal support layer) of the semiconductor substrate, reducing thickness by 50% compared to existing products, and SiP (System in Package) that embeds multiple semiconductor chips and passive components such as MLCC (Multi-Layer Ceramic Capacitor) inside the semiconductor substrate. They will also showcase the next-generation package substrate platform, System on Substrate (SoS). SoS is a package substrate with an ultra-fine process applied to arrange two or more semiconductor chips on the substrate.

This content was produced with the assistance of AI translation services.