Hanmi Semiconductor Launches Dual TC Bonder for HBM

Semiconductor equipment company Hanmi Semiconductor announced on the 24th that it will supply global semiconductor companies with the second-generation model of the essential process equipment for high-bandwidth memory (HBM) used in artificial intelligence (AI) semiconductors, the ‘DUAL TC BONDER 1.0 DRAGON’.

Hanmi Semiconductor Vice Chairman Kwak Dong-shin explained, "The newly released second-generation DUAL TC BONDER 1.0 DRAGON is an advanced bonding equipment for HBM production that stacks semiconductor chips made using the TSV process onto wafers," adding, "It is a core element for the learning and inference of big data used in AI computing and has recently attracted significant attention."

Hanmi Semiconductor has filed 106 patents (including pending applications) related to bonding equipment. The company holds a competitive edge with its unique technology and durability, and the competitiveness of its equipment is expected to increase further.

According to global market research firm Gartner earlier this year, the AI semiconductor market is expected to start at $34.3 billion (approximately 40 trillion KRW) in 2023 and grow at an average annual rate of 16%. By 2030, it is projected to reach $98 billion (approximately 125 trillion KRW), accounting for 31.3% of the entire system semiconductor market.

Founded in 1980, Hanmi Semiconductor officially participates as a sponsor in ‘Semicon China’ held annually in Shanghai, China, and ‘Semicon Taiwan’ held in Taipei, Taiwan. At next month’s Semicon Taiwan, the company will showcase the ‘TC BONDER CW (Thermo-Compressor Bonder Chip to Wafer),’ a 2.5D package type applicable to TSMC’s ‘CoWoS (Chip on Wafer on Substrate) package.’

This content was produced with the assistance of AI translation services.