Successful Localization of High-Precision Equipment for Automotive Semiconductor Processing

Mechanical Engineering Department Completes Development of Laser-Waterjet Hybrid Processing Machine
"Capturing Three Goals: High Precision, Eco-Friendly, and Low Cost"

Equipment capable of precision machining core semiconductor components for automobiles using lasers and water pressure has been domestically developed.

Waterjet and laser hybrid processing machine for vehicle semiconductor manufacturing developed by Korea Institute of Machinery and Materials. Photo by Korea Institute of Machinery and Materials

The Korea Institute of Machinery and Materials announced on the 8th that the research team led by Sanghoon An, Principal Researcher of the Optical Application Equipment Research Laboratory, succeeded in developing a laser-waterjet hybrid machining device that can freely process high-strength materials that are difficult to machine.

Automotive semiconductors are core components that control electronic devices and engines. Electric vehicles and autonomous vehicles require more electrical devices than conventional internal combustion engine vehicles, increasing the number of semiconductors used. With the newly developed laser-waterjet hybrid machining device, silicon carbide (SiC), which has attracted attention as a substrate for automotive semiconductors but was difficult to machine due to its high hardness and was processed relying on imported machines, can now be freely machined domestically.

The research team successfully developed a 200W-class green nanosecond laser, which had previously depended on foreign sources, for the first time in Korea. They also developed a stable optical system capable of maintaining precise machining positions for nine times longer than imported products during processing. High-pressure water generated by a high-pressure pump passes through a waterjet nozzle to form laminar flow longer than 50 mm inside the machining device, then the laser beam is focused on one point inside the laminar flow, allowing the product to be machined by the laser following the waterjet stream. The equipment was designed accordingly.

Looking at existing laser machining equipment, nanosecond laser machining devices used to divide semiconductor wafers have fast processing speeds but lack precision, while ultrashort pulse laser machining devices used to cut display glass offer precise machining but have slow processing speeds.

The laser-waterjet hybrid machining device developed by the research team can machine precisely at high speeds, and the large amounts of fine dust and smoke generated during conventional laser machining can be discharged through the waterjet, maintaining a clean working environment. It also has the advantage of being 20% cheaper than imported hybrid machining devices.

Principal Researcher An said, “We are pleased to have succeeded in developing the first domestic laser hybrid machining device, contributing to strengthening the technological competitiveness of Korea’s future semiconductor equipment industry,” and added, “This development is expected to secure competitiveness in the automotive semiconductor industry and contribute to expanding the market share of Korean companies.”

This content was produced with the assistance of AI translation services.