Samsung Electronics stated in a conference call following its Q2 earnings announcement on the 27th, "We plan to launch 32-gigabit (Gb) DDR5 to meet the demand for high-capacity modules required for data center AI," adding, "We will release it within the year based on advanced process technology to actively respond to high-performance computing demand." This was in response to questions about the technology areas they are focusing on amid increasing AI memory demand.


The company explained, "We are also developing LLW DRAM specialized for On Device AI," and added, "Although generative AI is evolving based on servers, On Device AI technology, which implements AI directly on the device for efficiency and security reasons, is expanding." They continued, "LLW offers low power characteristics along with higher bandwidth compared to existing LPDDR, enabling real-time processing of device data," and noted, "We aim for mass production by the end of 2024."


They are also developing DRAM that can be combined with logic through advanced package technology specialized for data center AI. Samsung Electronics stated, "It is more economical and can implement larger capacity than SRAM, effectively handling the rapidly increasing data," and added, "We have completed defining detailed product specifications in collaboration with major CPU customers and plan to provide differentiated solutions based on this."


[Concall] Samsung Electronics "32Gb DDR5 Launch Within This Year... New AI D-RAM Product Mass Production Next Year" View original image

They have also developed LP-CAM, a module based on LPDDR. The company explained, "LPDDR was used as a single component in mobile devices, but clients and server customers wanted to reduce power consumption by using LPDDR modules instead of existing DDR modules, so we developed LP-CAM," adding, "We plan to mass-produce prototypes in the first half of next year and prepare for low-power demand in PCs and servers in the second half."


To handle ultra-large AI models, they continue to develop memory semiconductor solutions such as HBM-PIM and PNM (Processing-in-Memory) to improve the data bottleneck between CPU and memory. On the storage side, to meet high-capacity demand, they plan to launch a TLC-based 64TB server SSD.



Samsung Electronics also explained that Graphics DDR (GDDR) can serve as AI memory. The company said, "We recently developed the industry's first 32-gigabit-per-second (Gbps) GDDR7, which is 1.4 times faster in data speed and 20% more power-efficient than the previous generation GDDR6," and predicted, "Based on this performance, GDDR7 will be widely used not only in PCs and gaming but also in high-performance computing and AI."


This content was produced with the assistance of AI translation services.

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