Hanmi Semiconductor Launches Wafer Micro SAW in China for the First Time

Semiconductor equipment company Hanmi Semiconductor has unveiled its wafer cutting saw (SAW) equipment, the ‘Full Automation Wafer Micro Saw (micro SAW W1121α),’ in China for the first time.

Hanmi Semiconductor announced on the 30th that it participated as an official sponsor in the ‘2023 SEMICON China Exhibition’ held in Shanghai, China.

The wafer micro saw is a fully automated standalone 12-inch wafer saw equipment that cuts wafers attached to wafer rings or tape in the semiconductor manufacturing process. It was developed by integrating Hanmi Semiconductor’s 43 years of know-how, precision machining, vision, and setting technologies. It features significantly enhanced productivity, precision, and user convenience functions compared to competitors.

A Hanmi Semiconductor official explained, "We are introducing this to the Chinese market for the first time through SEMICON China, the world’s largest exhibition in the semiconductor equipment materials field," adding, "We provide a standard 2-year warranty on all Hanmi Semiconductor micro saw equipment with confidence in quality."

They continued, "We expect to generate new sales separately from Hanmi Semiconductor’s existing main equipment through the micro saw equipment."

Since the launch of the ‘Dual Chuck Micro Saw,’ which was first successfully localized in June 2021, Hanmi Semiconductor has consecutively released the ‘Jumbo PCB Micro Saw,’ ‘Tape Micro Saw,’ and ‘Glass Micro Saw.’ The wafer micro saw is the sixth saw (SAW) model released by Hanmi Semiconductor. Hanmi Semiconductor is emerging as a leading specialized company in saw (SAW) equipment.

The 2023 SEMICON China, held until the 1st of next month at the Shanghai International Expo Center, is an industrial exhibition organized by the Semiconductor Equipment and Materials International (SEMI). This year, 1,060 semiconductor companies including ASML, Tokyo Electron, and Disco participated.

Hanmi Semiconductor will also participate as an official sponsor in the ‘2023 SEMICON Taiwan Exhibition’ held in Taipei, Taiwan, this September. The Dual TC Bonder, essential equipment for the TSV process broadband memory (HBM) production, is gaining attention as a core AI semiconductor equipment represented by AI software Chat GPT.

This content was produced with the assistance of AI translation services.