[Concall] Samsung Electro-Mechanics "Additional Supply Request for Server Semiconductor Substrates"

Samsung Electro-Mechanics announced that requests for semiconductor substrates for servers, such as flip chip-ball grid array (FC-BGA), continue to be received.

On the 26th, during the Q1 earnings conference call, Samsung Electro-Mechanics stated, "Additional supply of substrates for servers is continuing this year," and added, "The expansion of the server-dedicated substrate line is also progressing as planned."

They further noted, "In the mid to long term, substrates for servers are expected to experience continuous growth due to the emergence of AI models like ChatGPT."

On November 8 last year, Lee Jae-yong, Vice Chairman of Samsung Electronics (fifth from the left), attended the shipment ceremony for server FCBGA at Samsung Electro-Mechanics' Busan plant and took a commemorative photo with employees.
[Photo by Yonhap News]

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