‘Development of High-Performance Advanced Materials Applying LCP’
Leading the Electronics, Telecommunications, and Aerospace Components Market

Doosan Co., Ltd. is strengthening its competitiveness in flexible copper clad laminates (FCCL) by securing next-generation materials and technologies.


On the 3rd, Doosan announced that it has signed a Joint Development Agreement (JDA) with Ionic Materials, a U.S. polymer materials manufacturer, to develop high-performance advanced materials applying liquid crystal polymer (LCP).


LCP is a polymer that exhibits liquid crystal properties while in a liquid state and is a new material used in fields such as electronics, telecommunications, and aerospace. It has excellent insulation and dimensional stability (the ability to maintain its original shape despite changes in conditions such as temperature and humidity) and is easy to mold and process. It also has high heat resistance and strong adhesion, making it useful as a bonding material.


When films made of LCP are applied to FCCL, no separate adhesive layer is needed, allowing use in thin chip packages or display drivers. It is environmentally friendly and has characteristics of reduced electrical signal loss at higher frequency bands, making it suitable for next-generation communication products.


Bundang Doosan Tower <br>Photo by Doosan

Bundang Doosan Tower
Photo by Doosan

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Doosan plans to complete the development of FCCL applying LCP film by the end of this year and to secure a leading position in the next-generation mobile electronic devices and 5G·6G communication materials market. In the long term, it also plans to commercialize LCP films and LCP-based FRC.


FRC refers to a product that implements an RF cable, which transmits and receives signals between antennas and RF modules within mobile devices, in the form of a flexible printed circuit board (FPCB). It is resistant to bending, can be made thin, and one FRC can cover multiple antennas, resulting in high space efficiency.



A Doosan official said, “Doosan has continuously enhanced the competitiveness of copper clad laminate (CCL) products and has developed and commercialized various advanced materials and technologies such as PFC and 5G antenna modules.” He added, “We will continue to leverage the company’s experience and capabilities to discover new business items and nurture them as future growth engines.”


This content was produced with the assistance of AI translation services.

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