Groundbreaking Ceremony Held for Semiconductor Substrate Manufacturer Haesung DS in Changwon

Full-Scale Launch of 350 Billion KRW Expansion Investment at Changwon Plant

On the 12th at 11 a.m., Haesung DS, a semiconductor substrate manufacturing company in Changwon, Gyeongnam, held a groundbreaking ceremony for the expansion investment of its Changwon plant at its existing site within the Changwon National Industrial Complex.

[Asia Economy Yeongnam Reporting Headquarters, Reporter Song Jong-gu] Changwon Special City in Gyeongnam announced that semiconductor substrate manufacturer Haesung DS held a groundbreaking ceremony for the expansion investment of its Changwon plant at its existing site in Changwon National Industrial Complex at 11 a.m. on the 12th.

This groundbreaking ceremony follows the investment agreement signed in March between Changwon City and Haesung DS for an investment amount of 350 billion KRW and the creation of 300 new jobs.

About 100 people attended the event, including Hong Nam-pyo, Mayor of Changwon Special City; Kim Byung-gyu, Deputy Governor for Economic Affairs; Park Jong-won, Regional Economic Policy Officer of the Ministry of Trade, Industry and Energy; Kim Nam-gyun, Acting Director of the Korea Electrotechnology Research Institute; and Park Sung-gil, Head of the Gyeongnam Regional Headquarters of the Korea Industrial Complex Corporation.

This investment by Haesung DS is the largest scale since its establishment in 1984.

The global demand for lead frames and package substrates, which are the company’s main products and essential components for semiconductor packaging, has rapidly grown in line with the expansion of the automotive semiconductor market.

According to a recent report by global market research firm Omdia, the global automotive semiconductor market is expected to grow by about 18% this year, and Haesung DS’s growth prospects are also bright.

This was clearly reflected in the first-quarter operating results driven by lead frames, which account for 70% of the company’s sales.

Haesung DS announced its first-quarter results in April, reporting sales of 199.6 billion KRW and operating profit of 48.3 billion KRW, which increased sharply by 45.2% and 375.6%, respectively, compared to the same period last year.

Lead frames are key components that supply electricity to semiconductor chips installed in autonomous vehicles and support them.

Package substrates are substrates that transmit electrical signals between semiconductors and the mainboard.

Haesung DS plans to significantly expand its manufacturing facilities for lead frames and package substrates, semiconductor packaging components, from the current 86,576㎥ to approximately 157,200㎥ by 2026 by utilizing idle spaces such as parking lots within the Changwon plant.

Mayor Hong said, “I hope Haesung DS, which has repeatedly made proactive investments and technological innovations based on solid fundamentals, will become a global industry leader through this investment,” adding, “We will do our best to create an environment where advanced materials, parts, and equipment companies like Haesung DS can continue to invest in Changwon.”

This content was produced with the assistance of AI translation services.