Samsung Electro-Mechanics to Invest Additional 300 Billion KRW in Semiconductor Substrates

President Jang Deok-hyun: "Future IT Environment, Next-Generation Substrate Technologies like SoS Will Be a 'Game Changer'"

Jang Deok-hyun, President of Samsung Electro-Mechanics

[Asia Economy Reporter Park Sun-mi] Samsung Electro-Mechanics announced on the 22nd that it will make an additional investment of approximately 300 billion KRW to establish facilities for semiconductor package substrates (FCBGA).

The 300 billion KRW will be used for facility investments at the FCBGA production sites in Busan and Sejong, as well as the overseas production subsidiary in Vietnam. Through this investment, Samsung Electro-Mechanics plans to actively respond to the increasing demand for package substrates driven by the high performance of semiconductors and market growth. In particular, it aims to strengthen its position as a global top three player by mass-producing server package substrates for the first time domestically within this year and expanding high-end products such as servers, networks, and automotive electronics.

Package substrates are substrates that connect semiconductor chips and main substrates to transmit electrical signals and power, mainly used in CPUs (Central Processing Units) and GPUs (Graphics Processing Units) that require high-performance and high-density circuit connections. The package substrate market is expected to see increased demand centered on high-end products due to the advancement of server and PC performance, the high performance of semiconductors for CPUs and GPUs, and multi-chip packaging.

Samsung Electro-Mechanics explained that demand for high-end package substrates from global top customers is increasing, and demand for automotive package substrates is also rising due to the expansion of autonomous driving.

Jang Deok-hyun, CEO of Samsung Electro-Mechanics, said, "In future IT environments such as robots, cloud, metaverse, and autonomous driving, AI is becoming a core technology, making it very important for manufacturers of high-performance semiconductors like AI semiconductors to secure technologically advanced package substrate partners." He added, "Samsung Electro-Mechanics will become a 'game changer' in advanced technology fields through new concept package substrate technologies such as SoS (System on Substrate)."

This content was produced with the assistance of AI translation services.