[IPO] RayzerCell "Targeting Semiconductor, Electric Vehicle, and Display Industries with Membrane-Laser Technology"

Choi Jae-jun, CEO of LaserCell, is introducing the company at a corporate briefing session for KOSDAQ listing held on the 9th in Yeouido, Seoul. / Photo by LaserCell

[Asia Economy Reporter Jang Hyowon] “Area Laser optical technology can be applied in various fields, targeting the semiconductor, electric vehicle, and display industries alike.”

On the 9th, Choi Jaejun, CEO of LaserCell, held an investor briefing in Yeouido, Seoul, ahead of the company’s KOSDAQ listing, stating this.

Founded in 2015, LaserCell is the world’s first and only company to develop and own ‘Area Laser’ optical technology. Based on this technology, the company succeeded in developing area laser reflow equipment that bonds chips and semiconductor printed circuit boards (PCBs). LaserCell’s area laser reflow equipment irradiates the laser over an area rather than a point while maintaining uniform laser beam intensity.

With this technology, LaserCell is entering the semiconductor packaging process. Conventional packaging used mass reflow (MR) methods that heat air to bond chips and substrates, and thermal compression bonding (TCB) methods that heat and press chips to bond them to substrates.

CEO Choi explained, “Existing MR and TCB methods have issues such as warping and longer processing times. Using area laser reflow equipment eliminates warping and can reduce processing time per unit by 3 to 15 times compared to existing methods, making it more efficient.”

He added, “As data demand explodes, high capacity and fast data processing speeds of advanced semiconductors have emerged as core technologies. The solution is heterogeneous integration semiconductor technology, which bonds a central processing unit (CPU), graphics processing unit (GPU), and high-performance memory semiconductors onto a single semiconductor substrate (PCB) to integrate them into one device. The most suitable new method to implement such advanced semiconductor packaging is area laser reflow technology,” emphasizing its importance.

LaserCell’s technology can also be applied beyond heterogeneous semiconductor production, including bonding printed circuit boards (PCBs) within electric vehicle battery management systems (BMS) and mini LED debonding in next-generation displays.

LaserCell has continued to record operating losses until last year. As of last year, LaserCell posted sales of 9.7 billion KRW and an operating loss of 800 million KRW. The company expects sales to more than double this year and anticipates an operating profit of approximately 4.3 billion KRW.

LaserCell’s public offering amount is approximately 22.4 billion KRW based on the upper limit of the offering price band. The funds raised entirely through new shares will be invested in facility investments such as building research centers and mass production lines, as well as research and development for advancing area light source?area laser solutions and software development. Through this, the company plans to further expand its technological capabilities to meet global customer demands.

CEO Choi Jaejun stated, “LaserCell supplies differentiated products recognized for its technology by global top-tier companies in advanced semiconductor, next-generation display, and electric vehicle battery sectors. Through this KOSDAQ listing, we will continue research and development and expand various area laser-based technologies to evolve into the world’s only ‘Area Laser’ total solution platform.”

Meanwhile, LaserCell plans to offer a total of 1.6 million shares through this initial public offering. The expected offering price band per share is 12,000 to 14,000 KRW. Demand forecasting for institutional investors will be conducted over two days on the 9th and 10th to finalize the offering price, followed by a general subscription on the 14th and 15th. The company is scheduled to be listed on KOSDAQ in June, with Samsung Securities serving as the lead underwriter.

This content was produced with the assistance of AI translation services.