Samhwa Paint Develops Epoxy Sealing Material for Semiconductor Packaging

Epoxy Molding Compound for semiconductor packaging developed by Samhwa Paints.
[Photo by Samhwa Paints]

[Asia Economy Reporter Kim Jong-hwa] Samhwa Paint Industrial Co., Ltd. has completed the development of an 'Epoxy Molding Compound' for semiconductor packaging.

In December 2020, Samhwa Paint received the original technology for manufacturing a new epoxy resin from the Korea Institute of Industrial Technology. This technology changes only the structure of the epoxy resin itself, making the semiconductor packaging process easier while having the advantage of a world-class low coefficient of thermal expansion (the value of volume change due to temperature increase).

Based on this technology, Samhwa Paint succeeded in developing a tablet-type epoxy molding compound. Epoxy molding compounds come in tablet, liquid, and granule types, with the tablet type generally being the most widely used.

To develop the epoxy molding compound, Samhwa Paint upgraded the related team to a 'research institute' last year and increased the workforce by more than 30% compared to the existing personnel. Additionally, from last year to early this year, they completed the establishment of facilities for producing epoxy molding compounds at the Ansan plant. This production line has a different layout from the existing production methods and was independently developed by Samhwa Paint for epoxy molding compound production.

With the development of the epoxy molding compound, Samhwa Paint plans to immediately begin yield stabilization work through mass production. Once completed, full-scale mass production is expected to be possible.

A Samhwa Paint official stated, "We also plan to expand development of epoxy molding compounds capable of large-area packaging," adding, "Please watch how Samhwa Paint transforms into an electronic materials specialized company beyond the paint business."

This content was produced with the assistance of AI translation services.