Barun Electronics Obtains Patent for QFN Semiconductor Package Manufacturing
[Asia Economy Reporter Minwoo Lee] Barun Electronics announced on the 10th that it has obtained a patent for the "QFN Semiconductor Package Manufacturing Method." The company stated, "By attaching a protective film to the bottom surface of the lead frame before processing the lead frame, this technology prevents contamination caused by the molding compound, thereby reducing the defect rate." They added, "Through this, it is possible to resolve the issue of patent disputes related to half etching of the lead frame, which is the fundamental patent of the conventional QFN manufacturing method."
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