Top Engineering Acquires Patent Rights Related to Wafer Assembly
[Asia Economy Reporter Oh Ju-yeon] Top Engineering announced on the 21st that it has acquired an overseas patent related to wafer assembly. The company explained, "It pertains to a wafer tray that includes an upper tray and a lower tray to seat the wafer, where the wafer tray is assembled by the lower surface of the lower tray and the upper tray, as well as an assembly jig and assembly method for assembling the wafer tray."
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