Hanmi Semiconductor Unveils '2.5D TC Bonder' for the First Time at SEMICON China

DongShin Kwak, Chairman of Hanmi Semiconductor, announced on March 25 that he will participate as an official sponsor in the '2026 SEMICON China' exhibition, which is being held in Shanghai, China from March 25 to 27.

At this exhibition, Hanmi Semiconductor unveiled for the first time its new equipment for artificial intelligence (AI) semiconductors: the '2.5D TC Bonder 40', '2.5D TC Bonder 120', and 'Wide TC Bonder.' These advanced AI packaging machines integrate multiple chips—such as graphics processing units (GPUs), central processing units (CPUs), and high-bandwidth memory (HBM)—into a single package on a silicon interposer. According to the company, this marks a significant step as Hanmi Semiconductor is making a full-fledged entry into the rapidly expanding high-value-added AI semiconductor 2.5D packaging market.

Photo of Hanmi Semiconductor's booth at Semicon China 2026. Hanmi Semiconductor

Hanmi Semiconductor plans to launch the next-generation HBM production equipment, the 'Wide TC Bonder,' in the second half of this year. As the die area of HBM increases, this equipment enables a stable increase in the number of TSVs (through-silicon vias) and I/O (input/output interfaces). In addition, the number of micro-bumps connecting the DRAM die and the interposer increases, securing greater memory capacity and bandwidth, while also improving power efficiency compared to previous TC Bonders used for HBM production.

Chairman DongShin Kwak said, "Demand for AI semiconductor packaging is rapidly growing in the global market. Hanmi Semiconductor expects quarterly sales to continue rising to over 250 billion won per quarter starting from the second quarter of this year, and annual sales to grow by more than 40% compared to last year." According to a survey by TechInsights, Hanmi Semiconductor currently holds the No. 1 global market share in TC Bonders for HBM at 71.2%.

The SEMICON China exhibition, organized by the international semiconductor equipment and materials association (SEMI), is the largest semiconductor industry exhibition in the world, with semiconductor equipment, materials, components, and design companies from around the globe participating.

This content was produced with the assistance of AI translation services.