Lisa Su Meets with Younghyun Jeon
Full-Scale Collaboration on Next-Generation Semiconductor Foundry

Samsung Electronics and global semiconductor company AMD are embarking on full-scale cooperation to build next-generation artificial intelligence (AI) infrastructure.


On March 18, Samsung Electronics announced that it had signed a memorandum of understanding (MOU) with AMD at its Pyeongtaek campus to expand cooperation in the fields of next-generation AI memory and computing technology. The signing ceremony was attended by Younghyun Jeon, Head of Samsung Electronics Device Solutions (DS) Division, AMD CEO Lisa Su, and executives from both companies.

Young-Hyun Choi, Head of Samsung Electronics Device Solutions (DS) Division (right), and Lisa Su, CEO of AMD, are posing for a commemorative photo after signing a Memorandum of Understanding (MOU) at Samsung Electronics' Pyeongtaek Campus on the 18th. Samsung Electronics

Young-Hyun Choi, Head of Samsung Electronics Device Solutions (DS) Division (right), and Lisa Su, CEO of AMD, are posing for a commemorative photo after signing a Memorandum of Understanding (MOU) at Samsung Electronics' Pyeongtaek Campus on the 18th. Samsung Electronics

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Under this agreement, Samsung Electronics will be the priority supplier of HBM4 for AMD's next-generation AI accelerator, the Instinct MI 455X GPU. Samsung's HBM4 offers data processing speeds of up to 13 Gbps, significantly surpassing the industry standard of 8 Gbps.


The two companies also agreed to discuss foundry cooperation for contract manufacturing of next-generation products. Samsung Electronics plans to continuously expand its collaboration with global big tech companies by leveraging its strengths in turnkey solutions that span memory, foundry, and packaging.


Head Jeon stated, "Samsung and AMD share a common goal of advancing AI computing, and this agreement will further expand our scope of collaboration. We possess unique turnkey capabilities to support AMD's AI roadmap, from industry-leading HBM4 and next-generation memory architecture to cutting-edge foundry and packaging technologies."


CEO Su commented, "Close collaboration across the industry is essential to realize next-generation AI infrastructure. We are very pleased to combine Samsung's advanced memory technology leadership with AMD's GPU, CPU, and rack-scale platforms."



Samsung Electronics and AMD have built a partnership through joint innovation in graphics, mobile, and computing technologies for nearly 20 years. Their collaboration began in 2007, when Samsung's GDDR memory was adopted in AMD graphics cards. Since then, Samsung Electronics has served as a key supplier of HBM 3E for AMD's latest AI accelerators, the MI 350X and MI355.


This content was produced with the assistance of AI translation services.

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