Surging Demand for Hanmi Semiconductor MSVP Equipment Amid AI Semiconductor Boom

MSVP's Share in Total Sales Up 1.8 Times Year-on-Year
Sales Expected to Increase Compared to Last Year
Semiconductor Equipment Revenue Up, Market Outlook Expands

As the artificial intelligence (AI) industry expands, demand for semiconductors is surging, leading to an increase in purchases of Hanmi Semiconductor's Micro Saw & Vision Placement (MSVP) equipment.

MSVP is an essential semiconductor manufacturing process system that performs cutting, cleaning, drying, inspection, sorting, and stacking of semiconductor packages. MSVP is widely used not only in the production of DRAM, NAND flash, and HBM, but also in system semiconductor manufacturing processes. Consequently, as investment in AI semiconductors expands, demand for MSVP grows as well.

Since launching the first-generation MSVP in 1998, Hanmi Semiconductor has maintained the No. 1 global market share for 23 consecutive years since 2004. A company representative stated, "With the growth of the AI semiconductor market, semiconductor companies have been increasing their facility investments, and as a result, orders for MSVP have surged significantly since the end of last year. We expect sustained sales growth this year, and anticipate that this will contribute greatly to improved performance."

Hanmi Semiconductor's '7th Generation Micro Saw & Vision Placement 6.0 Griffin'. Hanmi Semiconductor.

Last year, the proportion of MSVP sales in Hanmi Semiconductor's total sales increased by approximately 1.8 times compared to 2024. With MSVP demand expected to rise again this year, Hanmi Semiconductor's MSVP sales are projected to increase compared to the previous year. As the AI data center and high-performance computing markets grow rapidly, securing productivity in semiconductor packaging processes is becoming even more critical.

Market forecasts support this trend. The global industry association SEMI reported that, driven by increased investments in AI-focused advanced logic, memory, and advanced packaging, worldwide semiconductor equipment sales reached USD 133 billion (approximately KRW 195 trillion) in 2025, up 13.7% from the previous year. For 2026, sales are projected to grow by 9% year-on-year to USD 145 billion (KRW 213 trillion), and to hit a record high of USD 156 billion (KRW 229 trillion) in 2027, an increase of 7.5%.

The latest model, the 7th Generation MSVP Griffin (MSVP 6.0 GRIFFIN), incorporates more than 207 patents. It features unmanned automation technologies such as Blade Change Master, Auto Kit Change, and the patented FSD (Full Self Device Setup) function. FSD enables the equipment to automatically recognize the align mark and generate reports by simply inserting strips and trays, without the need for engineer assistance. Previously, setting up the equipment required a skilled engineer eight hours, but with this technology, setup time has been reduced to just 35 minutes, greatly enhancing productivity and significantly reducing equipment management costs and operational burden.

Hanmi Semiconductor also holds the No. 1 position globally in the TC bonder market for high bandwidth memory (HBM), with a 71.2% market share. The company explained that with rising demand for both TC bonders for HBM and MSVP equipment, the potential for performance growth is expected to be even higher this year.

This content was produced with the assistance of AI translation services.