LG Chem Develops Key PID Material for Semiconductor Packaging... Targeting AI and High-Performance Markets

Collaboration with Leading Global Semiconductor Companies

LG Chem announced on September 29 that it has completed the development of a liquid PID (Photo Imageable Dielectric), a key material for advanced semiconductor packaging, and is set to actively target the AI and high-performance semiconductor markets.

PID is a photosensitive insulating material that forms fine circuits connecting semiconductor chips and substrates. It creates pathways for electrical signals, enhances circuit precision, and strengthens both performance and reliability. The importance of PID is increasing, especially for high-performance semiconductors, as they require denser circuitry.

Liquid PID for semiconductor packaging by LG Chem (right) and film PID (left). Provided by LG Chem

LG Chem's liquid PID enables high-resolution patterning, cures reliably even at low temperatures, and features low shrinkage and absorption rates, thereby improving process stability. Additionally, it does not use perfluoroalkyl substances (PFAS) or organic solvents (NMP, toluene), making it easier to comply with environmental regulations.

Targeting the PID market, which has traditionally been led by Japanese companies, LG Chem has also completed the development of a film PID. Leveraging its film technology accumulated in the display, semiconductor, and automotive sectors, the company is pursuing collaborations with global semiconductor firms. While conventional liquid PID has limitations in achieving uniform coating on large or double-sided substrates, film PID maintains uniformity in an attachable format and can be applied using lamination equipment already owned by substrate manufacturers.

LG Chem stated, "We have secured uniformity in thickness and patterning even on large substrates and minimized the occurrence of cracks," adding, "Process efficiency has also been improved since existing equipment can be used as is." Vice Chairman Shin Hakcheol of LG Chem said, "We are proactively providing a variety of materials to support customers' advanced packaging innovation," and added, "We aim to open new trends in the semiconductor market together with our customers, going beyond simply supplying materials."

In addition to the recent PID development, LG Chem is expanding the development of other key back-end process materials, including copper-clad laminates (CCL) for package substrates, die attach film (DAF) for semiconductor chips, non-conductive film (NCF) for high-performance memory packaging, and build-up film (BUF) for implementing high-layer structures, thereby strengthening its presence in the global semiconductor materials market.

This content was produced with the assistance of AI translation services.