Ansys Korea to Support Integrity Platform Across All Stages from Chip Design

Expansion of Simulation Solutions
CEO Park Juil Outlines Future Vision
Synergy from Synopsys M&A
Expectations for Enhanced Competitiveness of Korean HBM

Park Juil, CEO of Ansys Korea, stated at a media briefing held on the 16th at Lotte Hotel World in Songpa-gu, Seoul, "With the recently acquired Synopsys, we will soon be able to support an 'integrity platform' that prevents defects at every stage, from chip design to semiconductor production."

Paik Ju-il, CEO of Ansys Korea, is explaining the company's business direction at a media briefing held on the 16th at Lotte Hotel World in Songpa-gu, Seoul. Provided by Ansys Korea

Ansys, which currently provides artificial intelligence (AI)-based simulation solutions for the high bandwidth memory (HBM) production processes of Samsung Electronics and SK Hynix, unveiled a blueprint to expand its support further. This plan comes as competition in the HBM market intensifies with the arrival of the sixth-generation HBM4. As a result, there is growing interest in whether Korean companies can further enhance the completeness and market competitiveness of their HBM products.

Until now, Ansys’s solutions have focused on the chip production stage, including HBM, but the company now plans to expand its offerings to cover the very first step of chip production-design. This opportunity arose after Ansys completed its merger and acquisition (M&A) with the US-based semiconductor electronic design automation (EDA) company Synopsys on July 17, allowing the two companies to work together under one roof.

Ansys has primarily specialized in providing simulation solutions for design to companies in advanced industries. Headquartered in Pittsburgh, USA, the company entered the Korean market in 2012. Its solutions are commonly referred to as "engineering simulations." Companies that use Ansys’s solutions can conduct pre-production tests in virtual reality before manufacturing their products. This allows them to verify the feasibility of product completion and adjust their direction as needed. Sometimes, simulation AI even suggests ways to improve product quality and production speed.

Ansys’s solutions are especially prominent in the semiconductor sector, where they play a vital role in addressing heat dissipation issues-a major challenge in semiconductor manufacturing. If heat is generated after an AI chip is completed and assembled, the design process must start over, which is a significant burden. AI simulations help identify potential heat issues in advance, reducing this risk. In addition to Samsung Electronics and SK Hynix, which manufacture HBM, LG Electronics, which produces on-device AI chips, also collaborates with Ansys. CEO Park Juil explained, "In three-dimensional semiconductor stacking structures, including HBM, the challenge of delivering power efficiently is extremely difficult. If not done properly, it causes heat and warping." He added, "Correcting these issues through AI simulation is called 'power integrity,' and this is Ansys’s area of expertise." The M&A with Synopsys has given Ansys the opportunity to broaden the scope of this solution. Park further noted, "Since Synopsys already has deep collaborations with many of the world’s leading semiconductor companies, we expect to create strong synergy together."

This content was produced with the assistance of AI translation services.