SK Hynix to Exhibit 12-Stack HBM4 Model at GTC 2025

Operating an Exhibition Booth at GTC 2025
Theme: "The Future of AI Driven by Memory"
Unveiling the HBM4 12-Layer Model... SOCAMM and More on Display
Full Attendance by Top Executives Including CEO Kwak Nojeong

SK Hynix announced on the 19th that it will participate in NVIDIA's artificial intelligence (AI) conference 'GTC 2025,' held in San Jose, USA, until the 21st (local time), showcasing various memory products leading the AI era, including the 6th generation high-bandwidth memory (HBM) HBM4 12-layer model.

SK Hynix's HBM4 12-layer model and SOCAMM exhibited at GTC2025. Photo by SK Hynix

At this event, SK Hynix will operate a booth under the theme "The Future of AI Driven by Memory." The booth will captivate visitors with the company's next-generation HBM products, as well as memory solutions for AI data centers, on-device, and automotive sectors. Among these, on-device refers to implementing specific functions directly on the device itself without relying on computations from physically distant servers. The applied "On-Device AI" technology enables smart devices to independently collect information and perform computations, resulting in faster AI response times and enhanced AI services tailored to users.

The HBM4 12-layer model is expected to attract significant attention. SK Hynix is recognized as a leading technology provider in HBM, having become the world's first to mass-produce and supply NVIDIA with HBM3E 12-layer products. By the second half of this year, the company plans to complete preparations for mass production of the HBM4 12-layer product and begin supplying it according to customer demand. The HBM4 12-layer model showcased at this GTC serves as a "preview" to confirm this advancement in advance.

SK Hynix's GTC 2025 booth. Photo by SK Hynix

Additionally, SK Hynix will exhibit SOCAMM, a new AI server memory standard gaining attention. SOCAMM is an AI server-specialized memory module based on low-power DRAM.

Key company executives, including CEO Kwak No-jeong, AI Infrastructure President (CMO) Kim Ju-seon, and Vice President (Global S&M) Lee Sang-rak, will also attend to meet global AI leaders and strengthen cooperation. President Kim Ju-seon stated, "We are honored to showcase leading products for the AI era at this GTC," adding, "Through differentiated AI memory competitiveness, we will accelerate our future as a 'comprehensive AI memory supplier.'"

This content was produced with the assistance of AI translation services.