Gongju Jeongyang SG Wins Minister of Science and ICT Award for Developing Structural Thermal Break Material View original image

Jeongyang SG, a building materials company based in Gongju, Chungnam, that developed a structural thermal bridge breaker, received the Minister of Science and ICT Award at the "2024 Korea Innovation Challenge Research Open Exhibition" hosted by the Korea Institute of Science & Technology Evaluation and Planning.


Jeongyang SG's structural thermal bridge breaker was previously selected as one of the 26 outstanding achievements in solving social problems among 191 research and development outcomes in November.


According to Jeongyang SG on the 21st, a heat bridge is a structural pathway in buildings that allows heat to move easily due to having higher thermal conductivity than surrounding materials. If insulation performance is reduced by a heat bridge, significant heat loss and energy consumption occur, which can also lead to condensation.


A Jeongyang SG representative stated, "Applying the structural thermal bridge breaker to buildings maximizes insulation performance and reduces heating and cooling costs, thereby contributing to the reduction of carbon dioxide emissions from buildings."


They also added, "When this product is applied, it increases the surface temperature of indoor structures by at least 6°C, fundamentally solving chronic construction issues such as condensation and mold, and providing residents with a comfortable and healthy living environment."


Meanwhile, Jeongyang SG, founded in 1986, is a company specializing in the production of insulation and thermal bridge breakers, and has grown through continuous product development and innovation in the field of building insulation manufacturing for nearly 40 years.





This content was produced with the assistance of AI translation services.

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