AI Semiconductor Overcoming Heat Weakness... DeepX Demonstrates 'Low Power' with Butter Experiment

Entering Mass Production System Starting This Second Half of the Year

AI semiconductor startup DeepX conducted a 'butter benchmark' experiment using its AI semiconductor DX-M1, demonstrating performance differences compared to competing products.

According to DeepX on the 21st, this experiment involves placing butter, which melts at 30 to 36 degrees Celsius, on top of the semiconductor chip and observing how the butter changes due to the heat generated when the chip operates. If heat generated during semiconductor operation is not properly managed, performance can degrade, and in severe cases, system issues may occur. Since AI semiconductors consume a lot of power, heat management is crucial, and the DX-M1 has attracted attention for its low-power, high-efficiency design that addresses this issue.

DeepX's DX-M1 demonstrated excellent heat management by preventing the butter from melting while processing the representative AI model 'Yolo5s' 30 times per second. In contrast, competing products tested under the same conditions showed rapid melting of the butter, indicating poor heat management. Even with the complex AI model 'Yolov7,' the DX-M1 maintained temperatures 20 to 40 degrees Celsius lower than competing products, proving its performance superiority.

It was confirmed that DeepX's DX-M1 maintains stable performance even at high temperatures reaching 140 degrees Celsius. This highlights DeepX's technological prowess in delivering stable performance under extreme conditions. Low power consumption and heat management capabilities are important factors that enhance market competitiveness for products used in harsh environments such as edge devices.

DeepX began mass production of the DX-M1 in the second half of this year. During this process, various technical verifications are being conducted to ensure reliability testing and yield improvement, and the company is collaborating with semiconductor back-end service (OSAT) partners to develop chip packages suitable for various fields. Through this, DeepX is pursuing strategies to reduce production costs and improve quality.

Butter benchmark experiment and thermal imaging camera shooting data [Image source=DeepX]

DeepX is applying the DX-M1 in various fields such as security systems, robotics, and industrial solutions in collaboration with global companies. It provides solutions that can be widely used from single-board computers like Raspberry Pi to data centers, offering products that support various form factors and interfaces.

Additionally, DeepX is working with module manufacturers in Taiwan, China, the United States, and Europe to develop various hardware modules such as M.2 modules, E1.S, and PCIE card types. The company is expanding customer touchpoints through distribution networks in each region.

DeepX is also securing patents related to AI semiconductors to strengthen its leadership in the global AI semiconductor market. A DeepX representative stated, "We plan to occupy a unique position in the next-generation AI semiconductor field going forward."

This content was produced with the assistance of AI translation services.