[Click eStock] "Hanmi Semiconductor, Continued Benefits from HBM"

Hyundai Motor Securities forecasted on the 19th that Hanmi Semiconductor will greatly benefit as the global No.1 company in the HBM value chain.

Minjung Kwak, a researcher at Hyundai Motor Securities, explained, "The chip thickness standard up to HBM3 is 720㎛," adding, "As AI GPU chip manufacturers continue to release high-spec GPUs, the size standard for HBM4 and beyond is being raised to 720㎛ or more."

She continued, "The application of Hanmi Semiconductor's TSV-TC bonder is expected to increase further," and "there is a high possibility that the customer base will expand further to overseas HBM manufacturers."

Researcher Kwak estimated that the sales proportion of bonder equipment at Hanmi Semiconductor will rise to 58%.

She analyzed, "Due to the chip thickness standard increase following the release of high-spec GPUs, the addition of new overseas customers, and the possibility of direct packaging by chip manufacturers, Hanmi Semiconductor has a high potential to benefit."

This content was produced with the assistance of AI translation services.