Opening of Hanmi Semiconductor Bonder Factory

Semiconductor equipment company Hanmi Semiconductor announced on the 2nd that it has opened a 'Bonder Factory' to expand the production capacity of the 'DUAL TC BONDER,' an essential process equipment for producing broadband memory (HBM) for the recently spotlighted artificial intelligence (AI) semiconductors.

Hanmi Semiconductor established the Bonder Factory by utilizing its 3rd plant among the five factories it owns, totaling 20,040 pyeong in size. The 3rd plant features a large-scale cleanroom capable of assembling and testing about 50 semiconductor equipment units at once. It provides an optimal environment for producing TC bonders, including the Dual TC Bonder and flip-chip bonders.

A Hanmi Semiconductor official stated, "The global semiconductor market is expected to cautiously recover after hitting a bottom in the second half of this year," adding, "Since global key companies producing AI semiconductors are major customers of Hanmi Semiconductor, we have strived to establish advanced production capacity (CAPA) to prepare for changing market demands."

Founded in 1980, Hanmi Semiconductor was the only domestic semiconductor equipment company to participate as an official sponsor at the '2023 SEMICON China' exhibition held last month in Shanghai, China. The company also plans to continue its global marketing activities by participating as an official sponsor at the '2023 SEMICON Taiwan' exhibition to be held in Taipei, Taiwan, this September.

This content was produced with the assistance of AI translation services.