"Korea-Taiwan Must Unite in Semiconductors... Need for Packaging Technology Cooperation"

FKCCI and Taiwan International Economic Cooperation Association Jointly Hold the 47th Korea-Taiwan Economic Cooperation Committee Meeting

Advice has been given to increase cooperation between South Korea and Taiwan, leaders in the advanced semiconductor manufacturing sector. Domestic semiconductor companies are also urged to seek synergy with Taiwanese companies that possess packaging technology capabilities.

The Federation of Korean Industries held the '47th Korea-Taiwan Economic Cooperation Committee' jointly with the Taiwan International Economic Cooperation Association (CIECA) on the 1st at the Fardian Shangri-La Hotel in Taipei, Taiwan, to discuss these matters.

The Korea-Taiwan Economic Cooperation Committee is an annual event held to explore economic cooperation measures between the two countries. After being held online since the spread of COVID-19 in 2019, it was held offline again this year. About 100 people attended, including representatives from both sides’ delegations, Taiwanese businesspeople, and Korean businesspeople who have entered or plan to enter the local market, including the committee chairpersons from both sides.

Kim Jun, chairman of the Korea-Taiwan Economic Cooperation Committee, proposed at the event that the two countries, leaders in the semiconductor field, should increase cooperation in research and development (R&D), market development, technology collaboration in offshore wind power, and personnel exchanges.

Regarding cooperation in renewable energy, he said, "South Korea has the world's best technology in offshore wind power generation," adding, "Utilizing the advanced technology of Korean companies will help Taiwan's policy to expand offshore wind power using its natural environment." Taiwan has announced a plan to increase the share of renewable energy to 20% of total power generation by 2025.

Chairman Kim also stated, "To lay the foundation for Korea-Taiwan industrial cooperation and mutual development, we need to expand personnel exchanges among the younger generation," and "efforts should be made to increase exchange students and mutual employment in advanced technology fields such as semiconductors, artificial intelligence (AI), energy, and new materials."

Jo Eun-gyo, a senior researcher at the Korea Institute for Industrial Economics and Trade, pointed out that "Taiwan is about 10 years ahead of South Korea in the packaging field," and "especially has built a strong ecosystem from fabless (semiconductor design) to foundry (semiconductor contract manufacturing) and post-processing companies." She also said, "There is a need to increase technological development cooperation between Korean semiconductor companies and Taiwanese packaging companies."

Packaging refers to technology that stacks or bundles multiple semiconductors to enhance performance. It belongs to the post-processing field, which involves cutting and packaging semiconductor chips produced from silicon wafer substrates. Recently, it has been attracting attention as an alternative to overcome the limits of semiconductor fine processes.

This content was produced with the assistance of AI translation services.