Semiconductor Packaging Materials Market to Grow to 39 Trillion Won by 2027

Demand for Premium Packaging Grows with an Annual Increase of 2.7%

As demand for advanced packaging increases, the global semiconductor packaging materials market is expected to grow to $29.8 billion (approximately 39 trillion KRW) by 2027. Packaging is a semiconductor back-end process technology that stacks or bundles multiple semiconductors to enhance performance.

On the 24th, the Semiconductor Equipment and Materials International (SEMI) announced that the global semiconductor packaging materials market size will increase from $26.1 billion last year to $29.8 billion by 2027, growing at an average annual rate of 2.7%. This forecast comes from the Global Semiconductor Packaging Materials Outlook report jointly produced by SEMI, TechSearch, and Techcet.

Last year's global semiconductor materials market share by item /
[Image provided by SEMI]

The report includes a projection that the growth trend is possible due to increased demand for advanced packaging solutions driven by high-performance applications, 5th generation mobile communications (5G), artificial intelligence (AI), heterogeneous integration, and system-in-package (SiP) technologies.

Jay Baderman, CEO of TechSearch, said, "Demand for fan-in and fan-out wafer-level packaging, flip chip, and 2.5D/3D packaging is increasing due to advancements in dielectric materials and underfill materials," adding, "New substrate technologies such as silicon interposers using RDL (Re-Distribution Layer) and organic interposers are also growth drivers for packaging solutions." He also explained, "Research on glass core substrates and laminate substrates is ongoing."

This content was produced with the assistance of AI translation services.