SK Hynix to Unveil 'Ultra-High-Performance Enterprise SSD' at CES 2023

Introducing Core and New Memory Lineup under the Title 'Green Digital Solution'
Capturing Global Big Tech Companies with 'PS1010'

SK Hynix will showcase its flagship memory products and new lineup at CES 2023. From the top left clockwise: CXL Memory, PS1010 E3.S, HBM3, GDDR6-AiM products.
[Photo by SK Hynix]

[Asia Economy Reporter Han Yeju] SK Hynix announced on the 27th that it will showcase a large number of its flagship memory products and new lineups at 'CES 2023,' the world's largest electronics and IT exhibition, held in Las Vegas, USA, from January 5 to 8 next year.

An SK Hynix official explained, "At this CES, the company plans to present 'Green Digital Solutions,' a collection of products that drastically reduce carbon emissions in line with SK Group's direction of a 'carbon-free future.' We expect these products to attract the attention of global big tech customers and experts, as they significantly improve not only environmental impact reduction but also performance and efficiency compared to previous generations."

As the growth speed of advanced industries such as AI, big data, autonomous driving, and the metaverse accelerates, global technology companies are focusing on memory semiconductors that quickly process rapidly increasing data while enhancing energy efficiency. SK Hynix self-assessed that the products it will showcase at CES deliver excellent power efficiency and performance that meet these customer needs.

The company's representative exhibition product this time is the ultra-high-performance enterprise SSD 'PS1010 E3.S' (hereinafter PS1010). The PS1010 is a package product made by combining multiple SK Hynix 176-layer 4D NAND chips and supports the PCIe 5th generation (Gen 5) interface. Compared to the previous generation, PS1010's read and write speeds have improved by up to 130% and 49%, respectively. Additionally, it boasts more than 75% improved power efficiency, which is expected to reduce customers' server operating costs and carbon emissions.

Along with this, SK Hynix will showcase next-generation memory products suitable for high-performance computing (HPC) environments at the exhibition, including ▲ 'HBM3' ▲ 'GDDR6-AiM' ▲ 'CXL Memory.'

Yoon Jaeyeon, Vice President of SK Hynix (Head of NAND Product Planning), said, "We are proud to present SSD products that can solve server customers' pain points at CES, the world's largest event. Based on ultra-high-performance products equipped with our self-developed controllers and firmware, we expect the company's NAND business competitiveness to be further strengthened."

Meanwhile, SK Hynix's CES booth will also feature SK Enmove, SK Group's energy efficiency company, showcasing its 'immersion cooling' technology. This technology lowers the operating temperature of servers containing semiconductors. SK Hynix plans to continue expanding collaboration not only within the group but also with external partners to create new added value across the semiconductor business.

This content was produced with the assistance of AI translation services.