LG Innotek Unveils Advanced Substrate Technology at Korea's Largest Electronic Circuit Exhibition

[Asia Economy Reporter Suyeon Woo] LG Innotek is participating in the 'International Electronic Circuit and Mounting Industry Exhibition (KPCA show 2021)' held from the 6th to the 8th of this month at Songdo Convensia in Incheon Metropolitan City, showcasing its latest substrate products and technologies.

'KPCA Show 2021' is the largest electronic circuit specialized exhibition in Korea, with 105 domestic and international companies participating this year to share technology trends. At this exhibition, LG Innotek will unveil new substrate products in three areas: ▲5G AiP (Antenna in Package) substrates ▲Package Substrate ▲Tape Substrate.

In the 5G AiP field, which serves as an antenna that transmits and receives signals when mounted on smartphones, tablet PCs, etc., LG Innotek introduces the 'AiP substrate' along with core technologies such as low loss, multi-layer, and high-density substrate technologies. In 5G communication, signal loss increases as the frequency band used becomes higher, so reducing the amount of lost signal to improve communication performance is crucial.

LG Innotek's 'AiP substrate' has the advantage of minimizing signal loss. To reduce signal loss, it applies proprietary 'signal loss reduction technology,' processes the circuit surface inside the substrate to be smooth through special treatment to shorten the signal travel distance, and uses insulating materials with low signal interference.

The package substrate field involves semiconductor substrates used in mobile application processors (AP), memory, and more. LG Innotek exhibits RF-SiP (System in Package) substrates, CSP (Chip Scale Package) substrates, and Flip Chip CSP substrates.

In particular, the RF-SiP substrate used for communication semiconductors applies differentiated fine circuits, coreless technology (removal of the core layer of the semiconductor substrate), ultra-precision and high integration technologies, and new materials to reduce both thickness and signal loss compared to existing products. Using this product allows for more efficient internal smartphone design, as well as improvements in battery efficiency and heat dissipation issues.

The tape substrate field features COF (Chip On Film), 2-metal COF, and COB (Chip on Board). COF and 2-metal COF connect display panels and main substrates in smartphones, TVs, etc., while COB is used in credit cards, passports, and more. Among these, COF applies LG Innotek's unique ultra-fine process. This product is suitable for flexible or slim-thickness, thin-bezel displays and is seeing increased demand in high-resolution flexible displays such as OLED.

Jung Cheol-dong, President of LG Innotek, said, "The substrate and semiconductor packaging industries face many changes and challenges, including the pandemic," adding, "We hope this event will be an opportunity for growth and leap forward through mutual cooperation."

Meanwhile, at the awards ceremony held on the same day, Kwon Soon-gyu, Team Leader of SiP Development Team 1, received the KPCA PCB Industry Award. Team Leader Kwon was recognized for his contribution to enhancing the competitiveness of Korea's substrate and semiconductor packaging industries through the development of advanced semiconductor substrates.

This content was produced with the assistance of AI translation services.