[Concall] Samsung Electro-Mechanics "Package Substrate Prices to Continue Rising in Second Half"
[Asia Economy Reporter Kim Heung-soon] On the 28th, during the Q2 earnings conference call, Samsung Electro-Mechanics stated, "The market demand for package substrates continues to expand, and the supply-demand situation is tight from high-density to low-density products," adding, "Considering this market situation, prices are expected to continue rising in the second half of the year."
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