Sang-A Frontec Acquires Patent Rights for Low Dielectric Composite Film for CCL
[Asia Economy Reporter Ji Yeon-jin] Sang-A Front Tech announced on the 21st that it has acquired a patent related to low-dielectric composite films for copper clad laminates (CCL) and low-dielectric copper clad laminates (CCL) including these films.
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The flexible copper clad laminate (FCCL) material developed by the company exhibits uniform and excellent mechanical properties and dielectric characteristics, and its low dielectric loss properties minimize transmission loss in high-frequency bands.
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