Hanmi Semiconductor Launches 5th Generation New Flip-Chip Bonder

[Asia Economy Reporter Hyungsoo Park] Hanmi Semiconductor, a semiconductor equipment developer, announced on the 25th that it has launched the 5th generation new 'Flip Chip Bonder 5.0' equipment, which has dramatically improved performance after more than three years of research.

The Flip Chip Bonder is equipment that performs the process of connecting semiconductor chips to printed circuit boards (PCB). Through the solder ball bumping technique, it can perform smaller and more delicate processes than wire bonding using traditional materials such as gold, silver, and copper. It is mainly used to manufacture small IT devices such as smartphones, smartwatches, wireless earphones, and high-performance semiconductor chips.

Kim Minhyun, CEO of Hanmi Semiconductor, introduced, "Since the first generation model was launched in 2010, the Flip Chip Bonder 5.0, presented as the 5th generation model, has improved productivity by applying eight multi-die bonding headers."

He added, "Based on smart machine functions, we have enhanced precision and convenience," and "We expect a positive response from global semiconductor customers producing high-end packages for high-spec IT devices."

The Flip Chip Bonder equipment is essential for producing high-end non-memory semiconductor chips. European products have led the market. Hanmi Semiconductor plans to actively promote sales leveraging the outstanding performance of the Flip Chip Bonder 5.0.

According to the 'Global Semiconductor Fab Investment Trends' recently announced by SEMI, a global semiconductor equipment materials association, the semiconductor equipment market size next year is expected to grow about 10.8% compared to this year, reaching $70 billion (approximately 83 trillion KRW), the largest scale ever.

This content was produced with the assistance of AI translation services.