Mass Production Starts in First Half of Next Year... Sample Supply to Nvidia
"Dominant Position in AI Memory Market"

SK Hynix announced on the 21st that it has successfully developed a new ultra-high-performance DRAM product for AI (artificial intelligence) called 'HBM (High Bandwidth Memory) 3E' and has started supplying samples to customers to proceed with performance verification procedures.


'Processing 230 Full HD Movies Per Second' SK Hynix Develops World's Highest-Spec Memory View original image

HBM has been developed in the order of 1st generation (HBM) - 2nd generation (HBM2) - 3rd generation (HBM2E) - 4th generation (HBM3) - 5th generation (HBM3E), and HBM3E is an extended version of HBM3. SK Hynix stated, "We have succeeded in developing HBM3E, an extended version that delivers world-class performance," and added, "Based on the industry's largest HBM supply experience and mature mass production capabilities, we will begin mass production of HBM3E from the first half of next year to firmly establish a dominant position in the AI memory market."


HBM3E can process data at speeds of up to 1.15TB (terabytes) per second. This is equivalent to processing data amounting to more than 230 Full-HD (FHD) movies (5GB each) in just one second. Additionally, SK Hynix's engineers applied the latest Advanced MR-MUF (Mass Reflow Molded Underfill) technology to improve the product's heat dissipation performance by 10% compared to previous versions. HBM3E also offers backward compatibility, allowing customers to apply the new product without design or structural changes in systems originally configured with HBM3 in mind.


Ian Buck, Vice President of Hyperscale and HPC (High-Performance Computing) at NVIDIA, said, "NVIDIA has maintained a long-term collaboration with SK Hynix for HBM used in cutting-edge accelerated computing solutions," and added, "We look forward to continued cooperation between the two companies in the HBM3E field to introduce next-generation AI computing."



Ryu Seong-su, Vice President of SK Hynix (in charge of DRAM product planning), explained, "Through HBM3E, we have enhanced the completeness of our product lineup in the HBM market, which is gaining attention alongside AI technology advancements, and have solidified our market leadership," adding, "Going forward, the proportion of high-value-added HBM supply will continue to increase, accelerating the trend of improved business performance."


This content was produced with the assistance of AI translation services.

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