Costexis Launches Next-Generation Power Semiconductor Technology Overseas... "Recognized by NXP and Hyundai"

Kostexis, a specialized company in low thermal expansion and high thermal conductivity material components, announced on the 10th that it will showcase domestically produced high thermal conductivity materials and spacer technology for power semiconductors at Europe's largest power exhibition.

The exhibition Kostexis is participating in is 'PCIM Europe 2023,' held in Nuremberg, Germany. PCIM Europe is a world-leading exhibition showcasing cutting-edge technologies related to power electronics, power semiconductor components and modules, intelligent motion, renewable energy, and energy management.

At the exhibition, Kostexis will display core technologies and products of high thermal conductivity materials and spacers for power semiconductors. In particular, it will present chip spacers, via spacers, and interposers that demonstrate excellent characteristics in next-generation power semiconductors, laying the foundation for expanding its presence in the global market.

Han Gyu-jin, CEO of Kostexis, stated, "Kostexis prides itself on domestically developed low thermal expansion and high thermal conductivity material technology recognized by the global semiconductor company NXP," adding, "Next-generation power semiconductor spacers have also received favorable reviews from major automakers such as Hyundai Motor." He further added, "Starting with participation in the exhibition, we plan to intensify our efforts to target the global market."

Last month, Kostexis signed a $5.73 million order contract with the global semiconductor company NXP.

This content was produced with the assistance of AI translation services.