[Concall] Samsung Electro-Mechanics "No Delay in Mass Production Plan for Server FC-BGA... Starting in November" View original image

[Asia Economy Reporter Han Yeju] Samsung Electro-Mechanics announced that it is smoothly progressing with the mass production preparation of flip chip-ball grid array (FC-BGA) for servers.



On the 26th, during the Q3 earnings conference call, Samsung Electro-Mechanics stated, "The server FC-BGA is progressing as planned without any issues," and added, "Mass production will begin in November." They further mentioned, "We will focus on expanding production capacity (CAPA) until next year," and "We will continue to achieve steady sales growth."


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