NCN "Nextchip Selected as Lead Institution for Next-Generation Intelligent Semiconductor Technology Development Project"

[Asia Economy Reporter Yoo Hyun-seok] NCN announced on the 23rd that its subsidiary Nextchip has been selected as the lead organization for the Ministry of Science and ICT's next-generation intelligent semiconductor technology development project, "Edge Artificial Intelligence Processor Platform Technology," and will lead a research and development project worth 41.7 billion KRW over five years.

This project aims to expand the domestic artificial intelligence semiconductor ecosystem through SoC platformization and openness, enabling rapid application and solution development of computing AI processors at various edge levels based on collaborative inference between cloud and edge devices. The company expects that this will strengthen the competitiveness of domestic fabless semiconductor companies amid the recent technology trend focusing on edge computing technology.

A company official stated, "This project consists of four detailed tasks, including an open AI SoC platform based on industrial and technical requirements for intelligent edge computing, and specialized NPU development tasks such as SNN (Spike Neural Network) mimicking the human brain, dynamic variable precision, and maximizing data reuse," adding, "Nextchip will serve as the lead organization and the lead institution of the first detailed consortium, playing a leading role throughout the project."

Among these, the first detailed task, worth 18.8 billion KRW (14.9 billion KRW government funding and 3.9 billion KRW private contribution), will be responsible for developing data sensing, analysis, sharing, and deep learning processing accelerators. Nextchip, together with participating institutions such as Semifive, KETI, Acryl, Litvik, and Chungbuk National University, will build an AIoT integrated platform and verify the first detailed specialized solution.

Additionally, as the lead organization, Nextchip will promote the commercialization of development boards for rapid prototyping of On-Device Machine Learning products while also driving the dissemination of the platform developed in the overall project.

Jung Hoe-in, Executive Director of Nextchip, said, "By participating as the lead organization in this project, Nextchip holds significant meaning in playing a leading role in enhancing Korea's intelligent semiconductor competitiveness," and added, "We expect to generate substantial new sales in video application fields where edge computing technology integration is accelerating, such as the intelligent security camera market and intelligent black box market, by launching a multi-purpose edge-oriented AI SoC utilizing the results of this project, beyond the existing automotive electronic camera-based ADAS SoC business area."

This content was produced with the assistance of AI translation services.