From Paints to Semiconductor Materials: SP Samhwa Achieves Commercialization of EMC

Development of Semiconductor Packaging Material Achieved After 7 Years of R&D
Integration of Proprietary Formulation Technology and Patents Enables Warpage Control
Lineup of Five Products Completed, Applied to Latest Flagship Devices

SP Samhwa (formerly Samhwa Paints) has successfully commercialized epoxy molding compound (EMC), a key material for semiconductor packaging.


EMC products commercialized by SP Samhwa. SP Samhwa

EMC products commercialized by SP Samhwa. SP Samhwa

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On April 14, SP Samhwa announced that it has recently launched mass production of its new EMC products, which are optimized for high-performance and high-reliability semiconductor packages, and has begun supplying parts for mobile devices. EMC is an essential material that protects semiconductor chips from external factors such as heat, moisture, and impact.


SP Samhwa achieved commercial production just seven years after entering EMC research and development and four years after establishing its own dedicated production facilities at its Ansan plant. In 2020, SP Samhwa transferred the core technology for epoxy resin manufacturing from the Korea Institute of Industrial Technology, and in 2022, succeeded in developing tablet-type EMC. In 2025, the company obtained a patent for an "organic-inorganic composite for semiconductor packaging" that maximizes thermal conductivity while maintaining electrical insulation, further accumulating technological expertise.


Due to the exceptionally high technological barriers, the EMC market has long been dominated by a small number of global materials companies. SP Samhwa leveraged its formulation and synthesis expertise accumulated in the paint manufacturing process to expand into the semiconductor materials field, and after extensive research and development, succeeded in meeting semiconductor quality standards.


EMC products commercialized by SP Samhwa. SP Samhwa

EMC products commercialized by SP Samhwa. SP Samhwa

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This product is characterized by its innovative suppression of "warpage," a chronic issue in semiconductor packaging processes. As devices become thinner and semiconductor performance continues to advance, the role of materials that prevent package deformation becomes increasingly important. SP Samhwa's EMC has demonstrated excellent stability even under extreme conditions, passing reliability tests from customers and proving its quality.


SP Samhwa has developed a total of five EMC product lines. Of these, three are already applied to mass production lines, while the remaining two have also achieved mass-production-level quality. The product developed last year has been applied to the latest flagship devices, proving its performance, and the new product developed this year is scheduled to be installed in devices set for release in the second half of the year.


A representative from SP Samhwa stated, "Seven years after taking on the unfamiliar and challenging semiconductor materials market as a paint manufacturer, we have achieved meaningful results. This commercial success proves our technological capabilities in chemical materials, and with our new corporate name, we will diversify our business portfolio and strive to become a global comprehensive chemical company."

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