OISolution Launches 1.6Tbps OSFP and ELSFP Modules for AI Data Centers and CPO Systems

by Jang Hyowon

Published 13 Mar.2026 10:26(KST)

1.6Tbps OSFP (Octal Small Form-factor Pluggable) Optical Transceiver. Provided by Oisolution

OISolution is accelerating its push into the next-generation AI data center optical network market by unveiling new solutions tailored for this sector.

On March 13, OISolution announced that it will showcase a range of next-generation optical network solutions at OFC 2026, the world's largest optical communications exhibition, to be held at the Los Angeles Convention Center in the United States from March 17 to 19. The company will present its 1.6Tbps OSFP (Octal Small Form-factor Pluggable) optical transceiver, optimized for AI data center environments, as well as the ELSFP (External Laser Source Form-factor Pluggable) module for CPO (Co-Packaged Optics) systems.

Demand for ultra-high-speed networks is rapidly increasing due to the scaling up of AI models and the expansion of data center infrastructure, making optical interconnect technology between data centers more important than ever. In particular, in large-scale AI cluster environments, next-generation optical communication technologies capable of delivering ultra-high bandwidth and low-latency networks are becoming core infrastructure.

The newly released 1.6Tbps OSFP optical transceiver is a next-generation product that provides double the optical bandwidth compared to the existing 800Gbps models. OISolution has demonstrated perfect compatibility with major AI data center InfiniBand switches and Smart NICs through internal validation and interoperability tests.

This product supports ultra-high-speed data transmission required in AI data centers and high-performance computing (HPC) environments. It can be applied to 1600G Ethernet and InfiniBand environments, and supports not only 1x1600G single-mode connections but also breakout modes such as 2x800G, 4x400G, and 8x200G, allowing flexible adaptation to various network architectures.

OISolution is also actively responding to the emerging CPO (Co-Packaged Optics) market, which is gaining attention as a next-generation AI data center network technology. As AI models continue to grow in size and GPU clusters proliferate, the importance of CPO technology-which can simultaneously improve power efficiency and integration density within data center networks-is rising rapidly.

The newly unveiled ELSFP optical module serves as an external light source solution for CPO systems, offering high-power O-band laser sources at 20dBm and 23dBm per channel. Its pluggable structure allows the laser source to be separated from the switch front panel, protecting it from the high-temperature environment of switch ASICs and thereby enhancing the system’s thermal efficiency and reliability.

This module also supports the CMIS 5.3+ management interface and provides real-time status monitoring and predictive maintenance functions essential for data center operations through its versatile diagnostic monitoring (VDM) feature.

Wonki Lee, Executive Vice President and Head of Sales at OISolution, stated, "As data throughput in AI data centers increases, customers' demand for network bandwidth is expanding rapidly. In response to these market changes, we plan to strengthen our presence in the next-generation AI network market by leveraging our 1.6Tbps optical transceiver and CPO external light source solutions."

He added, "In CPO environments, key external light source technologies require high-power lasers and reliable packaging. Based on our core competencies in these areas, OISolution will continue to expand its portfolio of optical connectivity solutions to address next-generation 102.4Tbps switching environments."