[MWC26] SKT to Build AI Data Centers Faster and Cheaper with Three-Party Global Partnership

SK Telecom is working with global partners to reduce both the time and cost required to build artificial intelligence (AI) data centers (DC). The company plans to join forces with leading global manufacturers in the server and equipment industries to deliver a new type of data center solution.

On March 4, SK Telecom announced that it has signed a tripartite Memorandum of Understanding (MOU) for securing an integrated solution using the 'prefab modular' method with server manufacturer Supermicro and AI DC MEP (mechanical, electrical, plumbing) manufacturer Schneider Electric at the Mobile World Congress (MWC) 2026, the world's largest mobile exhibition currently taking place in Barcelona, Spain.

SK Telecom announced on the 4th that it has signed a tripartite Memorandum of Understanding (MOU) for securing an integrated solution using the 'prefab modular' method with server manufacturer Supermicro and AI data center MEP (mechanical, electrical, plumbing) manufacturer Schneider Electric at the Mobile World Congress (MWC) 2026, the world's largest mobile exhibition held in Barcelona, Spain. Haminyong, Head of AI Data Center Business at SK Telecom, Andrew Bradner, Senior Vice President of Schneider Electric, and Clay Simons, Vice President of Supermicro, are posing for a commemorative photo after signing the agreement. (from left) Provided by SK Telecom

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This collaboration focuses on securing an integrated model that shortens the construction period for AI DCs and addresses supply bottlenecks. The core of the partnership-the prefab modular method-involves pre-manufacturing modules for power, cooling, and IT infrastructure, then assembling them on site. This significantly reduces the time required to build AI data centers.

Unlike the traditional steel-reinforced concrete (SRC) method, where servers are installed sequentially after the building is completed, the new approach integrates servers, power, and cooling infrastructure into a single module, enabling integrated production. This enhances both construction speed and cost efficiency. Additionally, modules can be added incrementally as demand grows, allowing for flexible responses to market demand while reducing the burden of large upfront investments.

Supermicro is a manufacturer of server and storage systems. By collaborating with major AI semiconductor companies, Supermicro designs and supplies high-performance GPU servers specialized for AI training and inference. Last year, the company worked with leading U.S. big tech firms to build large-scale AI factories based on NVIDIA Blackwell GPUs and liquid cooling technology.

Supermicro plans to provide high-performance servers for AI computing and build GPU clusters that connect them. The company is also preparing integrated solutions that take into account core infrastructure elements such as cooling, supporting the rapid deployment of AI data centers.

Schneider Electric, a global specialist in energy management and automation, provides data center power management and digital operation management solutions. Last year, Time Magazine ranked Schneider Electric number one in its list of 'World's Most Sustainable Companies' for the second consecutive year.

For this collaboration, Schneider Electric will deliver an integrated MEP-based AI DC model, considering both infrastructure design and operational efficiency from the outset.

Haminyong, Head of AI Data Center Business at SK Telecom, stated, "Through this collaboration with leading global partners in the AI data center field, we are moving forward with an integrated prefab modular solution. Based on this, we aim to proactively meet the AI DC construction needs of global big tech clients and strengthen our competitiveness in terms of cost."

Clay Simons, Vice President of Supermicro, said, "This integrated solution will be based on Supermicro's high-performance GPU-optimized servers, tailored to customer workloads. We will continue to provide the latest technology to meet the rapidly increasing demand for AI data centers."

Andrew Bradner, Senior Vice President of Schneider Electric, commented, "Competitiveness in the AI era depends on how quickly and sustainably high-performance infrastructure can be built. Through this collaboration, we will present an integrated prefab modular-based AI DC model, reducing carbon emissions and resolving supply bottlenecks, while reliably supporting customers' high-density AI workload operations."

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