Hanmi Semiconductor to Launch Wide TC Bonder in Second Half of Next Year

Hanmi Semiconductor announced on November 4 that it plans to launch the 'Wide TC Bonder,' a next-generation high-bandwidth memory (HBM) production equipment, by the end of next year. Hanmi Semiconductor intends to supply the 'Wide TC Bonder' to its customers for the production of next-generation HBM chips.

The TC Bonder is a core piece of equipment required for manufacturing HBM for artificial intelligence (AI) semiconductors. HBM is produced by stacking multiple DRAM chips, and the TC Bonder is used in the process of precisely applying heat and pressure to each DRAM die for bonding.

Recently, the memory industry has been working on developing 'Wide HBM' chips, which feature an enlarged DRAM die size for next-generation HBM chips. As HBM evolves into next-generation products, there is increasing demand for greater memory capacity and faster data processing speeds. Instead of stacking more than 20 layers, the industry is now focusing on increasing the area of the HBM die itself.

When the die area of HBM becomes wider, it allows for a stable increase in the number of through-silicon vias (TSVs) and input/output (I/O) interfaces. The number of micro bumps connecting the DRAM die and the interposer also increases. This approach enables higher memory capacity and bandwidth, while offering easier thermal management and improved power efficiency compared to high-stacking methods.

The 'Wide TC Bonder' can be optionally equipped with a fluxless bonding feature. Fluxless bonding is a next-generation bonding technology that reduces the oxide layer on the chip surface without using flux. Compared to conventional methods, it eliminates the need for a residue cleaning process, simplifies the process, increases bonding strength, and enables a reduction in HBM thickness. Hanmi Semiconductor applied a celadon green color, inspired by Korean Goryeo celadon, to the design of the 'Wide TC Bonder.'

Industry experts predict that the adoption of the Wide TC Bonder will further delay the introduction of hybrid bonders, which had been considered for high-stacking production of next-generation HBM.

Hanmi Semiconductor Chairman Kwak Dongshin stated, "We plan to take the lead in supplying Wide TC Bonder equipment featuring new technologies in line with changes in HBM technology," adding, "We will contribute to strengthening our customers' competitiveness in next-generation HBM production."

Founded in 1980, Hanmi Semiconductor is a global semiconductor equipment company with approximately 320 customers worldwide. It currently ranks first globally in TC Bonder equipment for HBM production. Since 2002, the company has focused on strengthening its intellectual property rights and has filed more than 120 patents related to HBM equipment to date.

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